Title :
Silicon Micromachined W-Band Folded and Straight Waveguides Using DRIE Technique
Author :
Li, Yuan ; Kirby, Pete L. ; Papapolymerou, John
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA
Abstract :
A silicon micromachined W-band folded waveguide and straight waveguide using deep reactive ion etching (DRIE) technology with stacked silicon substrates are presented for the first time. The dimensions of the folded waveguide are optimized using Ansoft´s HFSS. The tolerances from the fabrication are analyzed using a straight waveguide. The measured insertion loss for the straight waveguide is between 0.23 ~ 0.42dB/cm over 85GHz ~ 105GHz. The insertion loss for the folded waveguide is between 0.41 ~ 0.69dB/cm over 90GHz ~ 110GHz. The result shows the waveguides have competitive performance compared to a commercial standard waveguide
Keywords :
micromachining; rectangular waveguides; silicon; sputter etching; 75 to 110 GHz; Ansoft HFSS; DRIE; Si; W-band waveguide; deep reactive ion etching; folded wavguide; insertion loss; micromachining; rectangular waveguide; straight waveguides; traveling wave tubes; Biomedical measurements; Costs; Insertion loss; Laser radar; Passivation; Protection; Rectangular waveguides; Silicon; Waveguide components; Wet etching; Deep reactive ion etching; Micromachining; Rectangular Waveguide; Traveling Wave Tubes;
Conference_Titel :
Microwave Symposium Digest, 2006. IEEE MTT-S International
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-9541-7
Electronic_ISBN :
0149-645X
DOI :
10.1109/MWSYM.2006.249790
