Title :
The Statistical Analysis of Chinese Stock Market Fluctuations by the Interacting Particle Systems
Author :
Wang, Tiansong ; Wang, Jun
Author_Institution :
Coll. of Sci., Inst. of Financial Math. & Financial Eng., Beijing Jiaotong Univ., Beijing
Abstract :
The statistical analysis of Chinese stock market fluctuations modeled by the interacting particle systems has been done in this paper. The contact process of the interacting particle systems is presented in this paper, where it is a continuous time Markov process, one interpretation of this model is as a model for the spread of an infection. Based on the contact process, a new stochastic stock price model of stock markets is modeled. From it, the statistical properties of Shenzhen composite Index are studied. The data of Shenzhen Stock Exchange (SZSE) Composite Index is analyzed, and the corresponding simulation is made by the computer computation, and we further investigate the statistical properties, fat tails phenomena and the power-law distributions of returns. The methods of Skewness-Kurtosis test, Kolmogorov-Smirnov test are applied to study the fluctuation behavior of the returns for the stock price and index.
Keywords :
Markov processes; pricing; statistical distributions; statistical testing; stock markets; Chinese stock market fluctuation; Kolmogorov-Smirnov test; Shenzhen stock exchange composite index; Skewness-Kurtosis test; contact process; continuous time Markov process; fat tail phenomena; particle system interaction; return power-law distribution; statistical analysis; stochastic stock price model; Analytical models; Computational modeling; Distributed computing; Fluctuations; Markov processes; Power system modeling; Statistical analysis; Stochastic processes; Stock markets; Testing; chinese stock market; fluctuation; interacting particle systems. the contact model;
Conference_Titel :
Computing, Communication, Control, and Management, 2008. CCCM '08. ISECS International Colloquium on
Conference_Location :
Guangzhou
Print_ISBN :
978-0-7695-3290-5
DOI :
10.1109/CCCM.2008.205