DocumentCode :
2718078
Title :
Extraction of parameters of high permittivity ultrathin (0.5-2.0 nm) gate dielectrics
Author :
Kar, S.
Author_Institution :
Dept. of Electr. Eng., Indian Inst. of Technol., Kanpur, India
Volume :
2
fYear :
2004
fDate :
4-6 Oct. 2004
Firstpage :
341
Abstract :
A new capacitance technique is proposed for the extraction of important parameters of MOS nano-transistors with high permittivity ultrathin (equivalent oxide thickness (EOT)=0.5 to 2.0 nm) gate dielectrics. These parameters include the gate dielectric capacitance, the flat-band voltage, the surface potential versus bias relation, the dielectric potential, the quantization indices for the accumulation and the strong inversion layer, the doping density profile right up to the interface, and the flat-band interface charge density.
Keywords :
MOSFET; capacitance; dielectric materials; doping profiles; elemental semiconductors; hafnium compounds; interface states; permittivity; semiconductor thin films; silicon; silicon compounds; space charge; surface potential; 0.5 to 2.0 nm; MOS nanotransistors; Si-SiO2-HfSiON-Si; dielectric potential; doping density profile; flat-band interface charge density; flat-band voltage; gate dielectric capacitance; high permittivity ultrathin gate dielectrics; quantization indices; surface potential; Capacitance measurement; Capacitance-voltage characteristics; Dielectric devices; High K dielectric materials; High-K gate dielectrics; MOS devices; Permittivity; Quantization; Space charge; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Conference, 2004. CAS 2004 Proceedings. 2004 International
Print_ISBN :
0-7803-8499-7
Type :
conf
DOI :
10.1109/SMICND.2004.1403011
Filename :
1403011
Link To Document :
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