• DocumentCode
    2718588
  • Title

    Numerical simulation on the HV transmission tower-line system under ice shedding

  • Author

    Fengli, Yang ; Jingbo, Yang ; Junke, Han ; Dongjie, Fu

  • Author_Institution
    China Electr. Power Res. Inst., Beijing, China
  • fYear
    2009
  • fDate
    26-30 Oct. 2009
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    Ice shedding from conductors may easily induce electrical and mechanical accidents, which cause serious threat to the safe operation of transmission lines. In this paper, a three dimensional finite element model of tower-conductor-ground wire-insulator system for a 500 kV transmission line was established in ANSYS, and the dynamic responses of ice shedding under different load cases were analyzed for the transmission tower-line system. Newmark method is applied for the solution of the nonlinear transient dynamic analysis. Three variables were considered in the ice-shedding simulating analysis, which includes tower-line coupled effect, phase combination of the ice-shedding conductors as well as thickness of the accreted ice. Influences of all the variables on the dynamic responses of jumping heights, loads at the end of insulators and the forces of transmission tower were mainly studied.
  • Keywords
    conductors (electric); dynamic response; finite element analysis; poles and towers; power transmission lines; transient analysis; ANSYS; HV transmission tower-line system; Newmark method; dynamic responses; ice-shedding simulating analysis; nonlinear transient dynamic analysis; numerical simulation; three dimensional finite element model; tower-conductor-ground wire-insulator system; Accidents; Analytical models; Conductors; Finite element methods; Ice; Nonlinear dynamical systems; Numerical simulation; Power system transients; Transient analysis; Transmission lines; Coupled effect; Ice shedding; Phase combination; Tower-line system; Unbalanced tension;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Transmission & Distribution Conference & Exposition: Asia and Pacific, 2009
  • Conference_Location
    Seoul
  • Print_ISBN
    978-1-4244-5230-9
  • Electronic_ISBN
    978-1-4244-5230-9
  • Type

    conf

  • DOI
    10.1109/TD-ASIA.2009.5356805
  • Filename
    5356805