DocumentCode :
2718644
Title :
Prediction of temperature rise in gas insulated busbar using multi-physics analysis
Author :
Kim, H.K. ; Oh, Y.H. ; Lee, S.H.
Author_Institution :
Korea Electrotechnol. Res. Inst., Changwon, South Korea
fYear :
2009
fDate :
26-30 Oct. 2009
Firstpage :
1
Lastpage :
4
Abstract :
This paper describes the coupled magneto-thermal analysis technique to calculate the temperature rise in the gas insulated switchgear (GIS) bus bar. Harmonic eddy current analysis is carried out and the power losses are calculated in the conductor and shield tank. Two methods are presented to analyze the temperature distribution on the conductor and tank surface. The one is to solve the thermal conduction problem with the equivalent natural convection coefficient and applied to the analysis of single phase GIS system. The other is to employ the computational fluid dynamics technique which directly solves the thermal-fluid equations inside the tank. The method is applied to the analysis of a three phase GIS problem. The accuracy of the developed technique is verified through the comparison of the measured and simulated temperature rise in a single phase and three phase GIS system.
Keywords :
busbars; eddy currents; gas insulated switchgear; harmonic analysis; heat conduction; computational fluid dynamics technique; conductor tank; coupled magneto-thermal analysis technique; equivalent natural convection coefficient; gas insulated switchgear busbar; harmonic eddy current analysis; multiphysics analysis; power losses; shield tank; thermal conduction problem; thermal-fluid equations; Conductors; Couplings; Eddy currents; Gas insulation; Geographic Information Systems; Magnetic analysis; Magnetic shielding; Power system harmonics; Switchgear; Temperature measurement; Gas insulated busbar; computational fluid dynamics; multi-physics; temperature rise;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Transmission & Distribution Conference & Exposition: Asia and Pacific, 2009
Conference_Location :
Seoul
Print_ISBN :
978-1-4244-5230-9
Electronic_ISBN :
978-1-4244-5230-9
Type :
conf
DOI :
10.1109/TD-ASIA.2009.5356808
Filename :
5356808
Link To Document :
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