DocumentCode
2719250
Title
Modeling and analysis of substrate coupling in integrated circuits
Author
Gharpurey, R. ; Meyer, R.G.
Author_Institution
Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
fYear
1995
fDate
1-4 May 1995
Firstpage
125
Lastpage
128
Abstract
A technique is presented for efficient calculation of substrate macromodels, which can be used to determine substrate coupling in integrated circuits. Examples of the technique applied to several test structures are presented
Keywords
SPICE; circuit analysis computing; digital simulation; integrated circuit modelling; mixed analogue-digital integrated circuits; substrates; IC modeling; SPICE; circuit simulation; mixed-signal circuits; simulation tools; substrate coupling; substrate macromodels; test structures; Capacitance; Circuit simulation; Circuit testing; Conductivity; Coupling circuits; Dielectric substrates; Distributed computing; Frequency estimation; Impedance; Integrated circuit modeling;
fLanguage
English
Publisher
ieee
Conference_Titel
Custom Integrated Circuits Conference, 1995., Proceedings of the IEEE 1995
Conference_Location
Santa Clara, CA
Print_ISBN
0-7803-2584-2
Type
conf
DOI
10.1109/CICC.1995.518150
Filename
518150
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