Title :
Modeling and analysis of substrate coupling in integrated circuits
Author :
Gharpurey, R. ; Meyer, R.G.
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., California Univ., Berkeley, CA, USA
Abstract :
A technique is presented for efficient calculation of substrate macromodels, which can be used to determine substrate coupling in integrated circuits. Examples of the technique applied to several test structures are presented
Keywords :
SPICE; circuit analysis computing; digital simulation; integrated circuit modelling; mixed analogue-digital integrated circuits; substrates; IC modeling; SPICE; circuit simulation; mixed-signal circuits; simulation tools; substrate coupling; substrate macromodels; test structures; Capacitance; Circuit simulation; Circuit testing; Conductivity; Coupling circuits; Dielectric substrates; Distributed computing; Frequency estimation; Impedance; Integrated circuit modeling;
Conference_Titel :
Custom Integrated Circuits Conference, 1995., Proceedings of the IEEE 1995
Conference_Location :
Santa Clara, CA
Print_ISBN :
0-7803-2584-2
DOI :
10.1109/CICC.1995.518150
