• DocumentCode
    271944
  • Title

    Average Power Handling Capability of Microstrip Passive Circuits Considering Metal Housing and Environment Conditions

  • Author

    Sánchez-Soriano, Miguel Á ; Queré, Yves ; Le Saux, Vincent ; Quendo, C. ; Cadiou, S.

  • Author_Institution
    Lab. des Sci. et Tech. de l´Inf., Univ. de Bretagne Occidentale, Brest, France
  • Volume
    4
  • Issue
    10
  • fYear
    2014
  • fDate
    Oct. 2014
  • Firstpage
    1624
  • Lastpage
    1633
  • Abstract
    In this paper, the average power handling capability (APHC) of microstrip passive circuits considering the metal housing and environment conditions is investigated in detail. A systematic method is proposed for the computation of the APHC of microstrip circuits in open and enclosed metal housing configurations, typically used in microwave components. The method also yields an estimate of the maximum temperature in a microstrip circuit for a given input power. Closed-form equations accounting for external conditions, such as convection or radiation heat transfer are given to evaluate the APHC. For validation, two microstrip bandstop filters centered at 10 GHz are analyzed following the proposed model, and the results are compared with those simulated showing a good agreement. In addition, both circuits are fabricated and characterized. Thermal profile measurements are provided, confirming the predicted results. The effect of the topology layout and the electromagnetic performance on the APHC are also discussed.
  • Keywords
    band-stop filters; microstrip circuits; packaging; passive networks; APHC; average power handling capability; closed-form equations; convection; enclosed metal housing configurations; environment conditions; frequency 10 GHz; microstrip bandstop filters; microstrip passive circuits; open metal housing configurations; radiation heat transfer; Dielectrics; Heat transfer; Heating; Metals; Microstrip; Passive circuits; Temperature measurement; Average power handling capability (APHC); electrothermal analysis; metal housing; microwave devices; planar circuits; power applications;
  • fLanguage
    English
  • Journal_Title
    Components, Packaging and Manufacturing Technology, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    2156-3950
  • Type

    jour

  • DOI
    10.1109/TCPMT.2014.2345100
  • Filename
    6883211