Title :
3-D extraction techniques for signal integrity analysis
Author :
Chou, M. ; Kamon, M. ; Nabors, K. ; Phillips, J. ; White, J.
Author_Institution :
MIT, MA, USA
Abstract :
In this survey paper we describe recently developed techniques for 3-D extraction of complicated interconnect structures which are both fast and sufficiently accurate to perform signal integrity analysis
Keywords :
electrostatics; fast Fourier transforms; integral equations; integrated circuit interconnections; integrated circuit modelling; integrated circuit packaging; iterative methods; magnetostatics; 3D extraction techniques; FFT; IC packaging; interconnect structures; signal integrity analysis; Capacitance; Circuit simulation; Conductors; Coupling circuits; Equivalent circuits; Integral equations; Integrated circuit interconnections; Magnetic analysis; Packaging; Signal analysis;
Conference_Titel :
Custom Integrated Circuits Conference, 1995., Proceedings of the IEEE 1995
Conference_Location :
Santa Clara, CA
Print_ISBN :
0-7803-2584-2
DOI :
10.1109/CICC.1995.518207
