DocumentCode
2720560
Title
International cooperation to develop low cost equipment devoted to microelectronics laboratory education
Author
Bonnaud, O. ; Carbone, B. ; Danto, Y. ; Ordonez, N. ; Morimoto, N. ; Mansano, R.D.
Author_Institution
Centre Commun de Microelectron. de l´´Ouest, Univ. de Rennes 1, Rennes
fYear
2008
fDate
June 29 2008-July 2 2008
Firstpage
178
Lastpage
181
Abstract
The pedagogical approach for engineers in EIE must include a part of practice that highlights and fixes the concepts in the mind of the future engineers. In the field of microelectronics, education in technology contributes to improve the quality and efficiency of the formation, but unfortunately, the cost of equipment in classical plants is extremely high; it is more and more difficult for an academic institution to buy and maintain fabrication equipment including cleanroom and associated process step machines. However, one can develop simplified process at low cost by relaxing the drastic rules of integrated microelectronics. This paper presents the approach to develop an alignment and exposure machine for processing small substrates, which was set up thanks to an international cooperation between two French microelectronics centres and a Brazilian laboratory. A prototype is now available and the first experiments have revealed some possibility of improvements that are now on progress. Dissemination in academic and research laboratories may be considered.
Keywords
electronic engineering education; integrated circuit manufacture; integrated circuits; laboratories; EIE; fabrication equipment; integrated microelectronics; international cooperation; low cost equipment; microelectronics laboratory education; process step machines; Computer science education; Costs; Educational technology; Fabrication; Laboratories; Lamps; Microelectronics; Optical control; Prototypes; Substrates; EIE education; international cooperation; microelectronics; process technology;
fLanguage
English
Publisher
ieee
Conference_Titel
EAEEIE Annual Conference, 2008 19th
Conference_Location
Tallinn
Print_ISBN
978-1-4244-2008-7
Electronic_ISBN
978-1-4244-2009-4
Type
conf
DOI
10.1109/EAEEIE.2008.4610182
Filename
4610182
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