DocumentCode :
2720866
Title :
Comparison between micro-objects manipulations in dry and liquid mediums
Author :
Gauthier, Michael ; Lopez-Walle, Beatriz ; Clévy, Cédric
Author_Institution :
UMR-CNRS, Besancon, France
fYear :
2005
fDate :
27-30 June 2005
Firstpage :
707
Lastpage :
712
Abstract :
In the submillimetric objects manipulations, the adhesion (capillary force, pull-off force and Van-der-Waals force) and the electrostatic forces affect the behavior of the micro-objects. These forces decrease significantly when the micro-objects are submerged in a liquid medium. So a microassembly task is easier to perform in a submerged medium than in air. Consequently, the study of the micro-objects assembly automation in liquid mediums is a promising topic. This article introduces a review of the major differences between dry and submerged micromanipulation. The influences of the medium on electrostatic forces, pull-off force and hydrodynamic forces are presented. Adhesion perturbations are significally reduced in liquid and hydrodynamic forces are advantageous to limit the maximal micro-objects velocity. Some comparative experimental micromanipulations are described and prove the interest of the liquid medium.
Keywords :
adhesion; capillarity; electrostatics; micromanipulators; van der Waals forces; Van-der-Waals force; adhesion perturbations; capillary force; dry medium; dry micromanipulation; electrostatic forces; hydrodynamic force; hydrodynamic forces; liquid force; liquid medium; micro-objects assembly automation; micro-objects manipulations; micro-objects velocity; microassembly task; pull-off force; submerged micromanipulation.; submillimetric objects manipulations; Adhesives; Assembly; Automatic control; Automation; Biological cells; Electrostatics; Hydrodynamics; Laboratories; Microassembly; Temperature control; Micromanipulation; electrostatic forces; hydrodynamic effects; liquid medium; pull-off force;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Computational Intelligence in Robotics and Automation, 2005. CIRA 2005. Proceedings. 2005 IEEE International Symposium on
Print_ISBN :
0-7803-9355-4
Type :
conf
DOI :
10.1109/CIRA.2005.1554360
Filename :
1554360
Link To Document :
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