“Dual-purpose” remateable Conductive Ball-in-Pit interconnects for chip powering and passive alignment in Proximity Communication enabled multi-chip packages

We propose a novel chip-to-chip interconnection, called Conductive Ball-in-Pit (CBiP), to simultaneously accomplish micron-scale layer-to-layer alignment and power-distribution that are essential in any Proximity Communication (PxC)-enabled multi-chip package. CBiP interconnects are demonstrated: (1) to be remateable, (2) to achieve a low-resistance contact between chips assembled in a face-to-face configuration, (3) to carry greater than 1.7 A of DC current, and (4) to passively align chips to within 3 μm.