DocumentCode :
2721189
Title :
High power laminate MEMS RF switch
Author :
Kim, Sung Jun ; Zhang, Yang ; Wang, Minfeng ; Bachman, Mark ; Li, G.-P.
Author_Institution :
Univ. of California, Irvine, Irvine, CA, USA
fYear :
2012
fDate :
May 29 2012-June 1 2012
Firstpage :
115
Lastpage :
120
Abstract :
An innovative high power radio frequency switch designed and manufactured using LMEMS (Laminate Micro Electro-Mechanical System) is reported. The LMEMS technology is developed by adopting current multi-layered printed circuit board (PCB) manufacturing technology, and integrating it with laminated layers including moving parts and specialty materials. RF switch performance is achieved by optimizing device design and layout for improving offstate isolation and reducing on-state insertion loss. High power performance is realized by use of laminate PCB technology and special contact metallurgy suitable for reducing both hot switching and high current welting. A RF LMEMS switch design is demonstrated to function up to 10 GHz and 50 W power handling capability.
Keywords :
laminates; microswitches; microwave switches; printed circuit design; printed circuit manufacture; frequency 10 GHz; high current welting; high power laminate MEMS RF switch; high power radio frequency switch; hot switching; laminate microelectromechanical system; laminated layer; multilayered printed circuit board manufacturing technology; offstate isolation; power 50 W; power handling; Coils; Microstrip; Microswitches; Radio frequency; Substrates;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd
Conference_Location :
San Diego, CA
ISSN :
0569-5503
Print_ISBN :
978-1-4673-1966-9
Electronic_ISBN :
0569-5503
Type :
conf
DOI :
10.1109/ECTC.2012.6248815
Filename :
6248815
Link To Document :
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