Title :
Index matched fluidic packaging of high power UV LED clusters on aluminum substrates for improved optical output power
Author :
Schneider, Marc ; Leyrer, Benjamin ; Herbold, Christian ; Maikowske, Stefan ; Brandner, Jürgen J.
Author_Institution :
Inst. for Data Process. & Electron. (IPE), Karlsruhe Inst. of Technol. (KIT), Karlsruhe, Germany
fDate :
May 29 2012-June 1 2012
Abstract :
We present an improved cooling for a high power density UV LED module for a wavelength of 395 nm. The module consists of 98 LED chips soldered on a thick film printed alumina substrate on an area of 2.11 cm2. We investigated cooling by a commercial water cooler as well as by a surface micro cooler developed by our own. Further we describe a technology to replace alumina by aluminum as substrate material. A module consisting of 25 UV LEDs was optically characterized without and with liquid encapsulation. Finally we conducted numerical studies to develop an easily producible, sufficiently powerful, and robust water cooler. Based on the results we present a water cooler design with cooling channels embedded in the aluminum substrate of an LED module, removing the interface between LED substrate and heat sink.
Keywords :
alumina; aluminium; cooling; electronics packaging; encapsulation; heat sinks; light emitting diodes; solders; thick films; Al; Al2O3; LED chips; aluminum substrates; commercial water cooler; cooling channels; heat sink; high power UV LED clusters; high power density UV LED module; index matched fluidic packaging; liquid encapsulation; printed alumina substrate; soldering; substrate material; surface microcooler; thick film; wavelength 395 nm; Aluminum; Cooling; Glass; Light emitting diodes; Optical refraction; Substrates; Temperature measurement;
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4673-1966-9
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2012.6248826
