Title :
Gold passivated mechanically flexible interconnects (MFIs) with high elastic deformation
Author :
Zhang, Chaoqi ; Yang, Hyung Suk ; Bakir, Muhannad S.
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
fDate :
May 29 2012-June 1 2012
Abstract :
This paper reports the fabrication and testing of gold passivated mechanically flexible interconnects (MFIs) with elastic deformation of 65 μm. It is shown that the gold passivation plays a critical role in preserving the lifetime of the flexible interconnects. The gold-passivated MFIs exhibit an unchanged force-displacement characteristic after being vertically indented 100 cycles.
Keywords :
elastic deformation; gold; indentation; integrated circuit interconnections; passivation; Au; elastic deformation; gold passivation; mechanically flexible interconnects; unchanged force-displacement characteristic; vertical indentation; Force; Gold; Passivation; Resistance; Silicon; Strain;
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4673-1966-9
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2012.6248835
