Integrating through-silicon vias with solder free, compliant interconnects for novel, large area interposers

Author

Shubin, Ivan ; Chow, Eugene M. ; Chow, Alex ; Thacker, Hiren D. ; DeBruyker, Dirk ; Fujimoto, Koji ; Raj, Kannan ; Krishnamoorthy, Ashok V. ; Mitchell, James G. ; Cunningham, John E.

Author_Institution

Oracle Labs., San Diego, CA, USA

fYear

2012

fDate

May 29 2012-June 1 2012

Firstpage

263

Lastpage

267

Abstract

A novel packaging module is described that is based on co-integration of flexible micro-spring interconnects with through silicon copper vias (TSVs) into a passive large area silicon interposer. We report on the packaging test vehicles based on such interposers that are designed to demonstrate a wafer scale integration process to form TSV+spring interconnects with high yield and low resistance. Our goal is to develop a scalable, large area die or MCM packaging platform to enable stress-free, readily reworkable packaging of chips and components with different functionality and technology. We show interposer layouts, share process details and characterization methods.

Keywords

integrated circuit interconnections; integrated circuit packaging; solders; three-dimensional integrated circuits; MCM packaging platform; TSV+spring interconnects; compliant interconnects; flexible microspring interconnect cointegration; interposer layouts; packaging module; packaging test vehicles; passive large area silicon interposer; share process; solder free; through-silicon vias; wafer scale integration process; Integrated circuit interconnections; Packaging; Resistance; Silicon; Springs; Substrates; Through-silicon vias;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd

Conference_Location

San Diego, CA

ISSN

0569-5503

Print_ISBN

978-1-4673-1966-9

Electronic_ISBN

0569-5503

Type

conf

DOI

10.1109/ECTC.2012.6248838

Filename

6248838