A Novel Spatial Power Combiner Based on SIW and HMSIW

Author

Hai-Yan Jin ; Wen, Guang-Jun ; Jin, Yan-Bin

Author_Institution

Sch. of Commun. & Inf. Eng., Univ. of Electron. Sci. & Technol. of China, Chengdu

fYear

2008

fDate

14-15 Dec. 2008

Firstpage

233

Lastpage

236

Abstract

In this paper, a Ka-band combining power amplifier based on SIW/HMSIW technology is presented and studied. The advantages of this structure are its low profile, low-lost, mass-productive, ease of fabrication and fully integrated with planar circuits. In addition, efficient heat sinking of monolithic microwave integrated circuit (MMIC) devices is achieved. Lastly a SIW/HMSIW power amplifier using eight MMIC amplifiers was designed and fabricated in 33.5-35.5 GHz. The measured results show a good agreement with simulation and a combining efficiency of 72% is achieved at 34.3 GHz.

Keywords

MMIC power amplifiers; power combiners; HMSIW; Ka-band combining power amplifier; MMIC amplifiers; SIW; combining efficiency; frequency 33.5 GHz to 35.5 GHz; half model substrate integrated waveguide; heat sinking; monolithic microwave integrated circuit; spatial power combiner; substrate integrated waveguide; Cogeneration; Electromagnetic heating; Fabrication; Heat sinks; Integrated circuit technology; MMICs; Microwave devices; Microwave integrated circuits; Power amplifiers; Power combiners; HMSIW; SIW; planar circuit; spatial power combiner and divider; transition;

fLanguage

English

Publisher

ieee

Conference_Titel

Art of Miniaturizing RF and Microwave Passive Components, 2008. IMWS 2008. IEEE MTT-S International Microwave Workshop Series on

Conference_Location

Chengdu

Print_ISBN

978-1-4244-2876-2

Electronic_ISBN

978-1-4244-2877-9

Type

conf

DOI

10.1109/IMWS.2008.4782309

Filename

4782309