Title :
Low temperature curable anisotropic conductive films (ACFs) with photo-active curing agent (PA-ACFs)
Author :
Kim, Il ; Paik, Kyung-Wook
Author_Institution :
Dept. of Mater. Sci. & Eng., Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea
fDate :
May 29 2012-June 1 2012
Abstract :
Ultra low temperature curable anisotropic conductive films with photo-active curing agent (PA-ACFs) have been newly developed with crosslinking systems using photoactive curing agents. PA-ACFs cannot be cured at temperature higher than 100°C before the UV activation, and the crosslinking systems do not work in fluorescent light. However, after the UV activation, PA-ACFs can be cured at 100°C within 15 seconds. Flex.-on-board (FOB) assembly using PA-ACFs showed the similar adhesion strength and joint resistances than those of the FOB assembly using conventional ACFs.
Keywords :
anisotropic media; conductive adhesives; UV activation; crosslinking systems; flex-on-board assembly; fluorescent light; photo-active curing agent; photoactive curing agents; temperature 100 C; time 15 s; ultra low temperature curable anisotropic conductive films; Assembly; Bonding; Curing; Films; Fluorescence; Resins; Substrates;
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4673-1966-9
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2012.6248863
