DocumentCode :
2722199
Title :
Creep behavior of joint-scale Sn1.0Ag0.5Cu solder shear samples
Author :
Burke, Cillian ; Punch, Jeff ; Collins, Maurice
Author_Institution :
Stokes Inst., Univ. of Limerick, Limerick, Ireland
fYear :
2012
fDate :
May 29 2012-June 1 2012
Firstpage :
505
Lastpage :
512
Abstract :
This study investigates the creep behavior of joint-scale Sn1.0Ag0.5Cu (SAC105) solder samples under shear loading. The objective of the work is to determine the Anand viscoplastic constitutive model parameters for this low silver content ternary SAC solder alloy. A series of monotonic constant shear stress (5-15MPa) and constant shear strain rate (1E-6-1E-2 (1/s)) tests was conducted at temperatures of 20°C, 50°C, 75°C and 100°C in order to provide data to extract the constitutive model parameters. The predictions of the Anand model are compared graphically with the experimental data in order to illustrate goodness-of-fit. SAC105 was found to be more creep resistant at higher strain rates than at lower strain rates for all temperatures and test conditions. The derived Anand parameters are shown to capture the creep performance of the SAC105 solder under shear loading very well, with the experimental data being tightly bound to the Anand predictions. In addition to the quantification of mechanical characteristics, a preliminary Electron Backscatter Diffraction (EBSD) investigation was conducted to investigate the effect of preconditioning on the grain structure of SAC105 solder joints. Results indicate that the misorientaion of the solder grains increased during preconditioning, signaling grain coarsening due to ageing.
Keywords :
ageing; copper alloys; creep; crystal microstructure; electron backscattering; shear strength; silver alloys; solders; tin alloys; viscoplasticity; Anand viscoplastic constitutive model; SnAgCu; ageing; creep resistant; electron backscatter diffraction; grain coarsening; grain structure; joint-scale SAC105 solder shear samples; low silver content; monotonic constant shear stress; preconditioning; shear loading; temperature 100 degC; temperature 20 degC; temperature 50 degC; temperature 75 degC; ternary SAC solder alloy; Creep; Mathematical model; Silver; Soldering; Strain; Stress;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd
Conference_Location :
San Diego, CA
ISSN :
0569-5503
Print_ISBN :
978-1-4673-1966-9
Electronic_ISBN :
0569-5503
Type :
conf
DOI :
10.1109/ECTC.2012.6248878
Filename :
6248878
Link To Document :
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