A new carrier structure for TSV thin wafer handling

Existing popular temporary bonding techniques for TSV thin wafer handling can be classified into three categories: (1) Carrier with via hole structure, for example: solution provided by TOK (zero Newton) process (2) Adhesion Layer separation type, for example: solution provided by 3M (WSS) process (3) High temperatures debonding process, solution for example: provided by Brewer Science (HT) process. Each type has its own challenges; for example: The carrier used in type 1 is easy to crack; the adhesive layer in type 2 may leave residues after high temperature process, and type (3) process need high temperature for de-bonding. Beside these issues, the investments in equipment and materials cost millions of dollars thus prevent wide application for TSV. Hence, it is desirable to have a low cost solution for the thin wafer carrier process.