Title :
A CMOS Bulk-Micromachined Thermal Imager
Author :
Liu, D.H. ; Zheng, L.S. ; Hsu, C.Y. ; Yao, D.J. ; Lu, M.S.C.
Author_Institution :
Inst. of Electron. Eng., National Tsing Hua Univ., Hsinchu
Abstract :
The thermal imager has been fabricated by successive dry etching steps after completion of CMOS. We are the first to successfully demonstrate thermal sensing by transistors operated in the sub-threshold region. With no need for deposition of sensing films as in conventional micro bolometers, this CMOS-based approach provides a low-cost sensing solution for fabrication of thermal imaging arrays
Keywords :
CMOS image sensors; infrared imaging; micromachining; CMOS thermal imager; bulk micromachining; low-cost sensing solution; micro bolometers; sensing film deposition; successive dry etching; thermal imaging arrays; thermal sensing; CMOS process; Circuits; Etching; Frequency; Infrared imaging; MOSFETs; Silicon; Temperature sensors; Thermal resistance; Threshold voltage;
Conference_Titel :
VLSI Technology, Systems, and Applications, 2006 International Symposium on
Conference_Location :
Hsinchu
Print_ISBN :
1-4244-0181-4
Electronic_ISBN :
1524-766X
DOI :
10.1109/VTSA.2006.251075
