Flip-chip ready 850 nm VCSEL with BCB planarization for optical interconnects

Author

Kim, Sang-Taek ; Kim, Seon Hoon ; Ki, Hyun Chul ; Kim, Tae Un ; Kim, Hyo Jin ; Ko, Hang Ju ; Kim, Hwe Jong

Author_Institution

Photonics Device Team, Korea Photonics Technol. Inst., Gwangju

fYear

2008

fDate

7-10 July 2008

Firstpage

1

Lastpage

2

Abstract

We have fabricated flip-chip ready 850 nm VCSEL with BCB planarization for optical printed circuit board. Low threshold current, high slope efficiency, and open eye diagram with high margin at 2.5 Gbps modulation are obtained in the VCSEL.

Keywords

flip-chip devices; integrated optoelectronics; laser beams; laser cavity resonators; optical fabrication; optical interconnections; planarisation; printed circuits; surface emitting lasers; BCB planarization; bit rate 2.5 Gbit/s; flip-chip ready VCSEL fabrication; low-threshold current; open eye diagram; optical interconnects; optical printed circuit board; slope efficiency; wavelength 850 nm; Distributed Bragg reflectors; Gallium arsenide; Gold; Optical devices; Optical interconnections; Oxidation; Planarization; Substrates; Threshold current; Vertical cavity surface emitting lasers;

fLanguage

English

Publisher

ieee

Conference_Titel

Opto-Electronics and Communications Conference, 2008 and the 2008 Australian Conference on Optical Fibre Technology. OECC/ACOFT 2008. Joint conference of the

Conference_Location

Sydney

Print_ISBN

978-0-85825-807-5

Electronic_ISBN

978-0-85825-807-5

Type

conf

DOI

10.1109/OECCACOFT.2008.4610379

Filename

4610379