Title :
Flip-chip ready 850 nm VCSEL with BCB planarization for optical interconnects
Author :
Kim, Sang-Taek ; Kim, Seon Hoon ; Ki, Hyun Chul ; Kim, Tae Un ; Kim, Hyo Jin ; Ko, Hang Ju ; Kim, Hwe Jong
Author_Institution :
Photonics Device Team, Korea Photonics Technol. Inst., Gwangju
Abstract :
We have fabricated flip-chip ready 850 nm VCSEL with BCB planarization for optical printed circuit board. Low threshold current, high slope efficiency, and open eye diagram with high margin at 2.5 Gbps modulation are obtained in the VCSEL.
Keywords :
flip-chip devices; integrated optoelectronics; laser beams; laser cavity resonators; optical fabrication; optical interconnections; planarisation; printed circuits; surface emitting lasers; BCB planarization; bit rate 2.5 Gbit/s; flip-chip ready VCSEL fabrication; low-threshold current; open eye diagram; optical interconnects; optical printed circuit board; slope efficiency; wavelength 850 nm; Distributed Bragg reflectors; Gallium arsenide; Gold; Optical devices; Optical interconnections; Oxidation; Planarization; Substrates; Threshold current; Vertical cavity surface emitting lasers;
Conference_Titel :
Opto-Electronics and Communications Conference, 2008 and the 2008 Australian Conference on Optical Fibre Technology. OECC/ACOFT 2008. Joint conference of the
Conference_Location :
Sydney
Print_ISBN :
978-0-85825-807-5
Electronic_ISBN :
978-0-85825-807-5
DOI :
10.1109/OECCACOFT.2008.4610379
