Stress profile derivation-an empirical approach

Author

Walker, Alan C.

Author_Institution

IBM Corp., San Jose, CA, USA

fYear

1990

fDate

10-14 Sep 1990

Firstpage

193

Lastpage

207

Abstract

The author describes how a thermal stress test profile was derived by experiment for more effective screening of IBM Personal System 2 planar cards. Profile components are optimized from Model 50 experimental data and reassembled into an empirically engineered power-temperature profile used in stress testing electronic cards. The resultant profile is shown to be more effective in accelerating early life failures and has become the standard framework for all PS/2 stress profiles used in IBM Greenock´s SMT (surface mount technology) card stress screening. Thermal shock and voltage biasing have been introduced into Greenock´s stress test for the first time

Keywords

IBM computers; life testing; printed circuit testing; stress measurement; surface mount technology; thermal stresses; Greenock´s stress test; IBM Personal System 2 planar cards; Model 50 experimental data; PS/2 stress profiles; SMT; card stress screening; life failures; power-temperature profile; ramp dwell time; ramp rates; surface mount technology; temperature limits; thermal shock; thermal stress test profile; voltage biasing; Acceleration; Data engineering; Electric shock; Electronic equipment testing; Power engineering and energy; Power system modeling; Surface-mount technology; System testing; Thermal stresses; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Test Conference, 1990. Proceedings., International

Conference_Location

Washington, DC

Print_ISBN

0-8186-9064-X

Type

conf

DOI

10.1109/TEST.1990.114018

Filename

114018