Title :
The size dependency of full IMC solder joint for 3D interconnection
Author :
Mo, Liping ; Wu, Fengshun ; Liu, Changqing ; Xia, Weisheng
Author_Institution :
Huazhong Univ. of Sci. & Technol., Wuhan, China
fDate :
May 29 2012-June 1 2012
Abstract :
The further miniaturization of electronic devices brings the challenge to the electronic packaging, especially for 3D interconnection as the miscrostructure of the solder joint could be replaced by IMC fully without any solder bulk remain. In this paper, both FE modeling and experimental testing were applied to investigate the stress distribution and the fracture mode of the solder joint under tensile load by considering the effect of IMC type and portion. Then, the size dependency regarding the IMC properties on grain size, defects, and crystallographic orientation has been pointed out to help understanding the reliability of full IMC joints.
Keywords :
finite element analysis; fracture; grain size; integrated circuit interconnections; integrated circuit modelling; integrated circuit packaging; integrated circuit reliability; solders; stress analysis; tensile testing; three-dimensional integrated circuits; 3D interconnection; FE modeling; crystallographic orientation; electronic devices; electronic packaging; experimental testing; finite element analysis; fracture mode; full IMC joint reliability; full IMC solder joint; grain defects; grain size; size dependency; solder joint microstructure; stress distribution; tensile load; Copper; Joints; Materials; Microstructure; Reliability; Soldering; Stress;
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4673-1966-9
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2012.6248931
