Title :
Preferred orientation of 30 μm fine pitch Sn2.5Ag micro-bumps studied by synchrotron polychromatic x-ray Laue microdiffraction
Author :
Tian, Tian ; Chen, Kai ; Kunz, Martin ; Tamura, Nobumichi ; Zhan, Chau-Jie ; Chang, Tao-Chih ; Tu, King-Ning
Author_Institution :
Dept. of Mater. Sci. & Eng., Univ. of California, Los Angeles, CA, USA
fDate :
May 29 2012-June 1 2012
Abstract :
Synchrotron radiation white beam x-ray microdiffraction was employed to study grain size and orientation of fine pitch Sn2.5Ag micro-bumps. The indexing of the Laue patterns shows that there is mostly one dominant grain orientation in each micro-bump. Moreover, a statistics study based on the characterization of 72 micro-bumps, shows that the [001] direction, which is the fast diffusion path for Ni/Cu atoms in Sn tends to be parallel to the substrate of the test vehicle. This property remains stable after repeated reflow processes.
Keywords :
X-ray diffraction; fine-pitch technology; silver alloys; synchrotron radiation; tin alloys; Sn2.5Ag; fine pitch microbumps; reflow processes; size 30 mum; synchrotron polychromatic X-ray Laue microdiffraction; synchrotron radiation white beam X-ray microdiffraction; test vehicle substrate; Grain size; Integrated circuits; Nickel; Reliability; Tin;
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4673-1966-9
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2012.6248938