• DocumentCode
    2723273
  • Title

    Adhesive flip chip bonding in a miniaturised spectrometer

  • Author

    Rusanen, Outi ; Keränen, Kimmo ; Blomberg, Martti ; Lehto, Ari

  • Author_Institution
    VTT Electron., Oulu, Finland
  • fYear
    1997
  • fDate
    26-30 Oct 1997
  • Firstpage
    95
  • Lastpage
    100
  • Abstract
    This paper discusses the selection of a suitable isotropically conductive adhesive for flip chip bonding of a micromachined component. The adhesive must have adequate electrical conductivity and mechanical bonding strength. Most commercial adhesives possess these qualities. In addition, small bumps of spherical shape need to be dispensed evenly and repeatedly. Eight adhesives were studied and one suitable candidate was found. The manufacture of the spectrometers proceeded successfully. The interferometer was fixed on top of a silicon detector by a flip chip technique using an isotropically conductive adhesive. Two prototype series with a total of 25 spectrometers have been produced, and 23 of them passed operational testing
  • Keywords
    adhesion; conducting polymers; electrical conductivity; elemental semiconductors; flip-chip devices; infrared detectors; infrared spectrometers; light interferometers; mechanical strength; microassembling; micromachining; microsensors; semiconductor device packaging; semiconductor device testing; silicon; Si; adhesive electrical conductivity; adhesive flip chip bonding; adhesive mechanical bonding strength; flip chip bonding; flip chip technique; interferometer; isotropically conductive adhesive; micromachined component; miniaturised spectrometer; operational testing; prototype spectrometers; silicon detector; spectrometer manufacture; spherical adhesive bumps; Bonding; Conductive adhesives; Conductivity; Detectors; Flip chip; Manufacturing; Prototypes; Shape; Silicon; Spectroscopy;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Polymeric Electronics Packaging, 1997. Proceedings., The First IEEE International Symposium on
  • Conference_Location
    Norrkoping
  • Print_ISBN
    0-7803-3865-0
  • Type

    conf

  • DOI
    10.1109/PEP.1997.656479
  • Filename
    656479