DocumentCode
2723273
Title
Adhesive flip chip bonding in a miniaturised spectrometer
Author
Rusanen, Outi ; Keränen, Kimmo ; Blomberg, Martti ; Lehto, Ari
Author_Institution
VTT Electron., Oulu, Finland
fYear
1997
fDate
26-30 Oct 1997
Firstpage
95
Lastpage
100
Abstract
This paper discusses the selection of a suitable isotropically conductive adhesive for flip chip bonding of a micromachined component. The adhesive must have adequate electrical conductivity and mechanical bonding strength. Most commercial adhesives possess these qualities. In addition, small bumps of spherical shape need to be dispensed evenly and repeatedly. Eight adhesives were studied and one suitable candidate was found. The manufacture of the spectrometers proceeded successfully. The interferometer was fixed on top of a silicon detector by a flip chip technique using an isotropically conductive adhesive. Two prototype series with a total of 25 spectrometers have been produced, and 23 of them passed operational testing
Keywords
adhesion; conducting polymers; electrical conductivity; elemental semiconductors; flip-chip devices; infrared detectors; infrared spectrometers; light interferometers; mechanical strength; microassembling; micromachining; microsensors; semiconductor device packaging; semiconductor device testing; silicon; Si; adhesive electrical conductivity; adhesive flip chip bonding; adhesive mechanical bonding strength; flip chip bonding; flip chip technique; interferometer; isotropically conductive adhesive; micromachined component; miniaturised spectrometer; operational testing; prototype spectrometers; silicon detector; spectrometer manufacture; spherical adhesive bumps; Bonding; Conductive adhesives; Conductivity; Detectors; Flip chip; Manufacturing; Prototypes; Shape; Silicon; Spectroscopy;
fLanguage
English
Publisher
ieee
Conference_Titel
Polymeric Electronics Packaging, 1997. Proceedings., The First IEEE International Symposium on
Conference_Location
Norrkoping
Print_ISBN
0-7803-3865-0
Type
conf
DOI
10.1109/PEP.1997.656479
Filename
656479
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