Assessment of non-uniform temperature effect on BGA de-component process

De-component is a critical process to either device reuse or rework. This paper investigated the temperature impact on the BGA during the de-component process. The non-uniform temperature was created by special designs of de-component fixtures. The temperature profiles of solder joints were monitored by thermocouples. Plastic ball grid arrays (PBGA) of three package sizes (23×23 mm, 27×27 mm and 35×35 mm) were included in this evaluation. Each package size contained both lead-free and lead-tin solder compositions. It was found that in order to achieve uniform bulk solder separation mode of solder joints, the temperature difference through the whole package should be within 5 °C. For the case of the temperature difference above this point, hybrid separation modes will occur, such as IMC fracture and pad cratering.