• DocumentCode
    2723858
  • Title

    An experimental study on reject ratio prediction for VLSI circuits: Kokomo revisited

  • Author

    Das, Dharam Vir ; Seth, Sharad C. ; Wagner, Paul T. ; Anderson, John C. ; Agrawal, Vishwani D.

  • Author_Institution
    Nebraska Univ., Lincoln, NE, USA
  • fYear
    1990
  • fDate
    10-14 Sep 1990
  • Firstpage
    712
  • Lastpage
    720
  • Abstract
    The authors report on an experiment to verify the accuracy of reject ratio predictions by the available approaches. The data collection effort includes instrumenting the wafer probe test to obtain chip failures as a function of applied vectors and running a fault simulator to obtain the cumulative fault coverage of these vectors. The accuracy of reject ratio predictions is judged by assuming earlier stopping points for the wafer probe, thereby gaining a measure of confidence in the final predicted value. The results of five different analyses are reported for over 70000 tested dies of a CMOS VLSI device. The five methods discussed predicted values for the reject ratio that vary by an order of magnitude at high values of fault coverage. It is shown that, with only an incremental effort during wafer probe, data collection that can be used to compare the relative accuracy of different models over a range of fault coverage is possible
  • Keywords
    CMOS integrated circuits; VLSI; automatic testing; data acquisition; failure analysis; fault location; integrated circuit testing; CMOS VLSI; VLSI; chip failures; cumulative fault coverage; data collection; fault coverage; fault simulator; reject ratio prediction; wafer probe test; Circuit faults; DH-HEMTs; Electronic equipment testing; Gain measurement; Manufacturing; Probes; Semiconductor device manufacture; Semiconductor device measurement; Semiconductor device testing; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference, 1990. Proceedings., International
  • Conference_Location
    Washington, DC
  • Print_ISBN
    0-8186-9064-X
  • Type

    conf

  • DOI
    10.1109/TEST.1990.114087
  • Filename
    114087