• DocumentCode
    2723923
  • Title

    Finite element modeling of anomalous moisture diffusion with dual stage model

  • Author

    Fan, Xuejun ; Nagaraj, Vishal

  • Author_Institution
    Dept. of Mech. Eng., Lamar Univ., Beaumont, TX, USA
  • fYear
    2012
  • fDate
    May 29 2012-June 1 2012
  • Firstpage
    1190
  • Lastpage
    1193
  • Abstract
    In this paper, finite element modeling of anomalous moisture diffusion using commercial finite element code is developed. The modeling method and numerical implementation is based on a dual stage model with both stages described by Fickian terms mathematically. The method is also extended to desorption process at reflow, in which the permanently trapped moisture content is a function of temperature. This paper details the finite element modeling implementation steps for both moisture absorption and desorption. The results are compared to the analytical solutions, and are also compared to the experimental data. A single script using ANSYS APDL is developed for the whole process including absorption and desorption phases.
  • Keywords
    diffusion; finite element analysis; moisture; reflow soldering; ANSYS APDL; Fickian terms; anomalous moisture diffusion; commercial finite element code; dual stage model; finite element modeling; moisture absorption; moisture desorption; permanently trapped moisture content; reflow; temperature function; Absorption; Equations; Finite element methods; Materials; Mathematical model; Moisture; Semiconductor device modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd
  • Conference_Location
    San Diego, CA
  • ISSN
    0569-5503
  • Print_ISBN
    978-1-4673-1966-9
  • Electronic_ISBN
    0569-5503
  • Type

    conf

  • DOI
    10.1109/ECTC.2012.6248987
  • Filename
    6248987