• DocumentCode
    2724214
  • Title

    Sensors for automatic process control of wire bonding

  • Author

    Or, S.W. ; Chan, H.L.W. ; Lo, V.C. ; Yuen, C.W.

  • Author_Institution
    Dept. of Appl. Phys., Hong Kong Polytech., Hung Hom, Hong Kong
  • Volume
    2
  • fYear
    1996
  • fDate
    18-21 Aug 1996
  • Firstpage
    991
  • Abstract
    PZT sensors were installed on an ultrasonic transducer used for wire bonding in order to record ultrasonic amplitude and bonding time during the bonding process. To find an appropriate location for the sensor placement, the vibration displacement distributions of the transducer were measured using a high frequency heterodyne interferometer. The non-linear signal detected by the PZT sensor was processed and the signatures of the higher frequency harmonics were recorded and related to the bonding quality. The change in harmonic contents and its relation with bond quality will be used to develop a real-time automatic process control system for wire bonding
  • Keywords
    lead bonding; lead compounds; piezoceramics; piezoelectric transducers; process control; ultrasonic transducers; PZT sensor; harmonic content; laser heterodyne interferometry; nonlinear signal detection; real-time automatic process control; ultrasonic bonding; ultrasonic transducer; vibration displacement distribution; wire bonding; Bonding processes; Displacement measurement; Frequency measurement; Process control; Signal detection; Signal processing; Ultrasonic transducers; Ultrasonic variables measurement; Vibration measurement; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Applications of Ferroelectrics, 1996. ISAF '96., Proceedings of the Tenth IEEE International Symposium on
  • Conference_Location
    East Brunswick, NJ
  • Print_ISBN
    0-7803-3355-1
  • Type

    conf

  • DOI
    10.1109/ISAF.1996.598195
  • Filename
    598195