Title :
Sensors for automatic process control of wire bonding
Author :
Or, S.W. ; Chan, H.L.W. ; Lo, V.C. ; Yuen, C.W.
Author_Institution :
Dept. of Appl. Phys., Hong Kong Polytech., Hung Hom, Hong Kong
Abstract :
PZT sensors were installed on an ultrasonic transducer used for wire bonding in order to record ultrasonic amplitude and bonding time during the bonding process. To find an appropriate location for the sensor placement, the vibration displacement distributions of the transducer were measured using a high frequency heterodyne interferometer. The non-linear signal detected by the PZT sensor was processed and the signatures of the higher frequency harmonics were recorded and related to the bonding quality. The change in harmonic contents and its relation with bond quality will be used to develop a real-time automatic process control system for wire bonding
Keywords :
lead bonding; lead compounds; piezoceramics; piezoelectric transducers; process control; ultrasonic transducers; PZT sensor; harmonic content; laser heterodyne interferometry; nonlinear signal detection; real-time automatic process control; ultrasonic bonding; ultrasonic transducer; vibration displacement distribution; wire bonding; Bonding processes; Displacement measurement; Frequency measurement; Process control; Signal detection; Signal processing; Ultrasonic transducers; Ultrasonic variables measurement; Vibration measurement; Wire;
Conference_Titel :
Applications of Ferroelectrics, 1996. ISAF '96., Proceedings of the Tenth IEEE International Symposium on
Conference_Location :
East Brunswick, NJ
Print_ISBN :
0-7803-3355-1
DOI :
10.1109/ISAF.1996.598195
