Title :
A fine pitch probe technology for VLSI wafer testing
Author :
Tada, T. ; Takagi, R. ; Nakao, S. ; Hyozo, M. ; Arakawa, T. ; Sawada, K. ; Ueda, M.
Author_Institution :
Mitsubishi Electr. Corp., Hyogo, Japan
Abstract :
The limitations of the cantilevered wire probe card with respect to both pin count and pin pitch are pointed out. The authors then present the structure and electric characteristics of a novel wafer probe card and its prototype with 80-μm pitch and 479 electrodes, obtained by etching a photosensitive transparent glass. With this probe-card technology it is possible to probe LSI with higher pin count and finer pitch pads
Keywords :
VLSI; integrated circuit testing; printed circuits; probes; test equipment; LSI; VLSI wafer testing; cantilevered wire probe card; electric characteristics; fine pitch probe technology; photosensitive transparent glass; pin count; pin pitch; wafer probe card; Electric variables; Electrodes; Etching; Glass; Large scale integration; Probes; Prototypes; Testing; Very large scale integration; Wire;
Conference_Titel :
Test Conference, 1990. Proceedings., International
Conference_Location :
Washington, DC
Print_ISBN :
0-8186-9064-X
DOI :
10.1109/TEST.1990.114110
