DocumentCode
2724285
Title
Hygrothermal reliability evaluation of plastic IC packages with computer-aided engineering tools
Author
Kuo, An-Yu ; Nguyen, Luu T.
Author_Institution
Optimal Corp., San Jose, CA, USA
fYear
1997
fDate
26-30 Oct 1997
Firstpage
158
Lastpage
168
Abstract
This paper presents the development and application of a computer-aided engineering tool, EPACK(TM), for hygro-thermal-mechanical performance and reliability evaluation of plastic IC packages. With this user-friendly and fully automated tool, a packaging engineer can perform reliability evaluation of a plastic IC package in minutes
Keywords
computer aided engineering; electronic engineering computing; integrated circuit modelling; integrated circuit packaging; integrated circuit reliability; mesh generation; plastic packaging; software tools; EPACK CAE tool; FEA mesh generation; computer-aided engineering tools; hygro-thermal-mechanical performance evaluation; hygrothermal reliability evaluation; plastic IC packages; reliability evaluation; user-friendly tool; Application software; Computer applications; Expert systems; Finite element methods; Integrated circuit packaging; Moisture; Performance evaluation; Plastic integrated circuit packaging; Reliability engineering; Semiconductor device packaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Polymeric Electronics Packaging, 1997. Proceedings., The First IEEE International Symposium on
Conference_Location
Norrkoping
Print_ISBN
0-7803-3865-0
Type
conf
DOI
10.1109/PEP.1997.656486
Filename
656486
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