Title :
Hygrothermal reliability evaluation of plastic IC packages with computer-aided engineering tools
Author :
Kuo, An-Yu ; Nguyen, Luu T.
Author_Institution :
Optimal Corp., San Jose, CA, USA
Abstract :
This paper presents the development and application of a computer-aided engineering tool, EPACK(TM), for hygro-thermal-mechanical performance and reliability evaluation of plastic IC packages. With this user-friendly and fully automated tool, a packaging engineer can perform reliability evaluation of a plastic IC package in minutes
Keywords :
computer aided engineering; electronic engineering computing; integrated circuit modelling; integrated circuit packaging; integrated circuit reliability; mesh generation; plastic packaging; software tools; EPACK CAE tool; FEA mesh generation; computer-aided engineering tools; hygro-thermal-mechanical performance evaluation; hygrothermal reliability evaluation; plastic IC packages; reliability evaluation; user-friendly tool; Application software; Computer applications; Expert systems; Finite element methods; Integrated circuit packaging; Moisture; Performance evaluation; Plastic integrated circuit packaging; Reliability engineering; Semiconductor device packaging;
Conference_Titel :
Polymeric Electronics Packaging, 1997. Proceedings., The First IEEE International Symposium on
Conference_Location :
Norrkoping
Print_ISBN :
0-7803-3865-0
DOI :
10.1109/PEP.1997.656486
