Title :
Glob-top reliability characterisation: evaluation and analysis methods
Author :
Doyle, Rory ; Flynn, Brendan O. ; Lawton, Willie ; Barrett, John ; Buckley, Jason
Author_Institution :
Nat. Microelectron. Res. Centre, Univ. Coll. Cork, Ireland
Abstract :
Glob-top encapsulation has found widespread acceptance in electronics assembly for low-end consumer products. To extend the use of this encapsulation method to high reliability and harsh environment conditions, a rigorous evaluation of the available materials is needed. Analysis techniques to determine failure modes and mechanisms are also necessary to fully understand and improve glob-top performance. This paper outlines the results of glob-top reliability trials and also includes findings on both destructive and nondestructive analysis techniques
Keywords :
consumer electronics; encapsulation; failure analysis; integrated circuit packaging; integrated circuit reliability; integrated circuit testing; nondestructive testing; consumer products; destructive analysis techniques; electronics assembly; encapsulation method; failure mechanisms; failure modes; glob-top encapsulation; glob-top performance; glob-top reliability; glob-top reliability tests; harsh environment conditions; high reliability devices; nondestructive analysis techniques; reliability; reliability analysis methods; reliability evaluation; Assembly; Educational institutions; Encapsulation; Failure analysis; Materials reliability; Microassembly; Microelectronics; Packaging; Testing; Thermal stresses;
Conference_Titel :
Polymeric Electronics Packaging, 1997. Proceedings., The First IEEE International Symposium on
Conference_Location :
Norrkoping
Print_ISBN :
0-7803-3865-0
DOI :
10.1109/PEP.1997.656487
