DocumentCode
2724428
Title
An accurate current reference using temperature and process compensation current mirror
Author
Yang, Byung Do ; Shin, Young Kyu ; Lee, Jee Sue ; Lee, Yong Kyu ; Ryu, Keuu Chul
Author_Institution
VLSI Circuit & Syst. Lab., Chungbuk Nat. Univ., Cheongju, South Korea
fYear
2009
fDate
16-18 Nov. 2009
Firstpage
241
Lastpage
244
Abstract
In this paper, an accurate current reference using temperature and process compensation current mirror (TPC-CM) is proposed. The temperature independent reference current is generated by summing a proportional to absolute temperature (PTAT) current and a complementary to absolute temperature (CTAT) current. The temperature coefficient and magnitude of the reference current are influenced by the process variation. To calibrate the process variation, the proposed TPC-CM uses two binary weighted current mirrors which control the temperature coefficient and magnitude of the reference current. After the PTAT and CTAT currents are measured, the switch codes of the TPC-CM are fixed in order that the magnitude of reference current is independent to temperature. And, the codes are stored in the non-volatile memory. In the simulation, the effect of the process variation is reduced to 0.52% from 19.7% after the calibration using a TPC-CM in chip-by-chip. A current reference chip is fabricated with a 3.3V 0.35um CMOS process. The measured calibrated reference current has 0.42% variation.
Keywords
CMOS analogue integrated circuits; current mirrors; reference circuits; CMOS; accurate current reference; size 0.35 micron; temperature and process compensation current mirror; temperature independent reference current; voltage 3.3 V; Current measurement; Diodes; Mirrors; Nonvolatile memory; Resistors; Semiconductor device measurement; Solid state circuits; Switches; Temperature control; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Circuits Conference, 2009. A-SSCC 2009. IEEE Asian
Conference_Location
Taipei
Print_ISBN
978-1-4244-4433-5
Electronic_ISBN
978-1-4244-4434-2
Type
conf
DOI
10.1109/ASSCC.2009.5357223
Filename
5357223
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