• DocumentCode
    2724428
  • Title

    An accurate current reference using temperature and process compensation current mirror

  • Author

    Yang, Byung Do ; Shin, Young Kyu ; Lee, Jee Sue ; Lee, Yong Kyu ; Ryu, Keuu Chul

  • Author_Institution
    VLSI Circuit & Syst. Lab., Chungbuk Nat. Univ., Cheongju, South Korea
  • fYear
    2009
  • fDate
    16-18 Nov. 2009
  • Firstpage
    241
  • Lastpage
    244
  • Abstract
    In this paper, an accurate current reference using temperature and process compensation current mirror (TPC-CM) is proposed. The temperature independent reference current is generated by summing a proportional to absolute temperature (PTAT) current and a complementary to absolute temperature (CTAT) current. The temperature coefficient and magnitude of the reference current are influenced by the process variation. To calibrate the process variation, the proposed TPC-CM uses two binary weighted current mirrors which control the temperature coefficient and magnitude of the reference current. After the PTAT and CTAT currents are measured, the switch codes of the TPC-CM are fixed in order that the magnitude of reference current is independent to temperature. And, the codes are stored in the non-volatile memory. In the simulation, the effect of the process variation is reduced to 0.52% from 19.7% after the calibration using a TPC-CM in chip-by-chip. A current reference chip is fabricated with a 3.3V 0.35um CMOS process. The measured calibrated reference current has 0.42% variation.
  • Keywords
    CMOS analogue integrated circuits; current mirrors; reference circuits; CMOS; accurate current reference; size 0.35 micron; temperature and process compensation current mirror; temperature independent reference current; voltage 3.3 V; Current measurement; Diodes; Mirrors; Nonvolatile memory; Resistors; Semiconductor device measurement; Solid state circuits; Switches; Temperature control; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Circuits Conference, 2009. A-SSCC 2009. IEEE Asian
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4244-4433-5
  • Electronic_ISBN
    978-1-4244-4434-2
  • Type

    conf

  • DOI
    10.1109/ASSCC.2009.5357223
  • Filename
    5357223