DocumentCode :
2724599
Title :
Structural functionality analysis of nanostructured thermal interface materials
Author :
Xue, Xiangdong ; Bailey, Chris ; Lu, Hua ; Alam, Ohidul
Author_Institution :
Sch. of Comput. & Math. Sci., Univ. of Greenwich, London, UK
fYear :
2012
fDate :
May 29 2012-June 1 2012
Firstpage :
1431
Lastpage :
1436
Abstract :
This paper reports a qualitative mechanical investigation of structural functionality in nanostructured thermal materials, in the respect of thermal interface materials (TIM) in particular. The development of structural role in thermal materials is firstly briefed through the development of structural complexity as filler phase. The reasons for the outstanding thermal conductivity owned by nanostructured materials are then examined through the responses of atomic lattice structures in transferring thermal energy. The scattered and diluted behaviour of nanostructured materials when used as the filler phase in nanostructured composites is finally analysed. It is concluded that under the push of high performance microelectronic systems, the filler phase has been developed from simple bits to nanostructures and from random distribution towards controlled alignment; that the atomic lattice stiffness play a core role for thermal energy transmission for carbon materials; and that, while a decrease of nanostructure performance with composites is inevitable, an appropriate construction of nanostructured frames can increase structural integrity and promote the release of nanostructured characteristics. This work has close relevance to the application of nanostructured materials, in particular for TIM in microelectronic systems and, it is expected, could promote relevant thinking for combining the natural property of materials and the state of the arts of structural patterns.
Keywords :
composite materials; integrated circuits; nanostructured materials; thermal conductivity; TIM; atomic lattice stiffness; carbon materials; diluted behaviour; filler phase; high performance microelectronic systems; nanostructured thermal interface materials; structural complexity; structural functionality analysis; structural integrity; thermal conductivity; thermal energy transmission; Conductivity; Lattices; Manufacturing; Nanostructured materials; Nanostructures; Thermal conductivity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd
Conference_Location :
San Diego, CA
ISSN :
0569-5503
Print_ISBN :
978-1-4673-1966-9
Electronic_ISBN :
0569-5503
Type :
conf
DOI :
10.1109/ECTC.2012.6249024
Filename :
6249024
Link To Document :
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