DocumentCode
2724621
Title
An 8Gb/s/link, 6.5mW/Gb/s memory interface with bimodal request bus
Author
Chang, Keng ; Lee, Haechang ; Wu, Ting ; Kaviani, Kambiz ; Prabhu, Kashinath ; Beyene, Wendemagegnehu ; Chan, Norman ; Chen, Catherin ; Chin, T.J. ; Gupta, Alok ; Madden, Chris ; Mahabaleshwara ; Raghavan, Leneesh ; Shen, Jie ; Shi, Xudong
Author_Institution
Rambus Inc., Los Altos, CA, USA
fYear
2009
fDate
16-18 Nov. 2009
Firstpage
21
Lastpage
24
Abstract
An 8 Gb/s/link power optimized controller memory interface is implemented in TSMC 40 nm G CMOS process. It is composed of 32 differential data links to support 32 GB/s payload. The bimodal drivers of the request bus enable support of both 12 bits of 2 Gb/s/link single-ended RSL (rambus signaling level) for existing XDRTM memory and 6 bits of 8 Gb/s/link differential signaling for next generation XDR2TM memory. A 1-tap pre-emphasis transmitter equalizer and a source-degenerated linear receiver equalizer with offset trim are added on this controller interface to reduce signal swing and thus minimize power in both write and read directions. The measurement results show that with a 100 mV swing (peak-to-peak single-ended) for the read and a 150 mV swing for the write, the timing margin is greater than 0.25 UI at a BER of 10-12 with real memory transactions. The measured power efficiency for the PHY is 6.5 mW/Gb/s.
Keywords
CMOS digital integrated circuits; DRAM chips; computer interfaces; driver circuits; equalisers; error statistics; system buses; 1-tap pre-emphasis transmitter equalizer; BER; DRAM; TSMC CMOS process; XDR memory; bimodal drivers; bimodal request bus; bit rate 32 Gbit/s; differential data links; link power optimized controller memory interface; memory interface; rambus signaling level; signal swing; size 40 nm; source-degenerated linear receiver equalizer; voltage 100 mV; Bit error rate; CMOS process; Equalizers; Payloads; Physical layer; Power measurement; Random access memory; Read-write memory; Timing; Transmitters;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Circuits Conference, 2009. A-SSCC 2009. IEEE Asian
Conference_Location
Taipei
Print_ISBN
978-1-4244-4433-5
Electronic_ISBN
978-1-4244-4434-2
Type
conf
DOI
10.1109/ASSCC.2009.5357237
Filename
5357237
Link To Document