A 1.8dB NF 300mW SiP for 2.6GHz diversity S-DMB application

Author

Hong, Seokyong ; Kang, Tae-Shin ; Hwang, Myung-Woon ; Beck, Sungho ; Lee, Jeong-Cheol ; Ahn, Moon-Kyung ; Jo, Hyunha ; Lim, Seungbum ; Kim, Taeshin ; Lee, Sangjin ; Yoo, Seungyup ; Lee, Jong-Ryul ; Han, Sangwoo

Author_Institution

Future Commun. IC Inc., Sungnam, South Korea

fYear

2009

fDate

16-18 Nov. 2009

Firstpage

29

Lastpage

32

Abstract

This paper presents a 1.8 V 300 mW System-In-Package (SiP) solution in mobile S-DMB application. This achieves a 1.8 dB noise figure at 2.6 GHz, while the measured sensitivity is -101 dBm at diversity mode. The SiP is integrated RF tuner, demodulator, SDRAM and other passive components. An internal AGC is integrated for over 100 dB dynamic range. The SiP is 196 pins LFBGA and the size is 10 mm Ã— 10 mm Ã— 1.3 mm. The SiP consumes 300 mW.

Keywords

mobile communication; system-in-package; SDRAM; demodulator; frequency 2.6 GHz; integrated RF tuner; internal AGC; mobile S-DMB application; noise figure 1.8 dB; passive components; power 300 mW; system-in-package solution; voltage 1.8 V; Adaptive filters; Application specific integrated circuits; Baseband; Demodulation; Dynamic range; Energy consumption; Noise measurement; Packaging; Radio frequency; Tuners; RF tuner; S-DMB; System-in-Package;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Circuits Conference, 2009. A-SSCC 2009. IEEE Asian

Conference_Location

Taipei

Print_ISBN

978-1-4244-4433-5

Electronic_ISBN

978-1-4244-4434-2

Type

conf

DOI

10.1109/ASSCC.2009.5357239

Filename

5357239