Green future: IC packaging opportunities abound

Author

Tong, Ho-Ming

Author_Institution

Group R&D, ASE Group, Kaohsiung, Taiwan

fYear

2009

fDate

16-18 Nov. 2009

Firstpage

1

Lastpage

4

Abstract

Today, as global environmental regulations are being tightened, both IC and package technologies are also becoming far more complicated. More Moore and more than Moore, which manifest themselves in system-on-chip (SoC) and system-in-a-package (SiP), respectively, are being used more in combination to meet the ever-more-stringent cost and time-to-market requirements of consumer products with more functions built in them. In this presentation, I will review the challenges and opportunities to IC packaging as a direct outcome of the above trends to ensure SoC and SiP based IC packages meet the needs of the present generation without compromising the ability of future generations.

Keywords

consumer products; environmental factors; semiconductor industry; system-in-package; system-on-chip; IC packaging; SiP; SoC; consumer products; cost requirements; system-in-a-package; system-on-chip; time-to-market requirements; Acceleration; Cellular phones; Consumer products; Costs; Electronics industry; Integrated circuit packaging; Lead; Planets; Research and development; Time to market;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State Circuits Conference, 2009. A-SSCC 2009. IEEE Asian

Conference_Location

Taipei

Print_ISBN

978-1-4244-4433-5

Electronic_ISBN

978-1-4244-4434-2

Type

conf

DOI

10.1109/ASSCC.2009.5357242

Filename

5357242