• DocumentCode
    2724826
  • Title

    Cost-effective low-loss flexible optical engine with microlens-imprinted film for high-speed on-board optical interconnection

  • Author

    Shiraishi, Takashi ; Yagisawa, Takatoshi ; Ikeuchi, Tadashi ; Ide, Satoshi ; Tanaka, Kazuhiro

  • Author_Institution
    Fujitsu Labs. Ltd., Atsugi, Japan
  • fYear
    2012
  • fDate
    May 29 2012-June 1 2012
  • Firstpage
    1505
  • Lastpage
    1510
  • Abstract
    There is a strong demand for optical interconnection technology to overcome bandwidth bottlenecks in high-end server systems. The interconnection speed in present systems is approaching 10 Gb/s, and higher-speed interconnections over 25 Gb/s are being discussed. To achieve such optical interconnections in commercial production, it is necessary to develop lower-cost and higher-speed optical transceiver modules. We propose a flexible printed circuit optical engine (FPC-OE) with a microlens-imprinted film and a polymer waveguide to achieve low-cost and high-speed operation. The microlens-imprinted film can be produced at low cost by using nanoimprint technology and can drastically reduce the optical loss of the FPC-OE with polymer waveguide. We successfully demonstrated error-free operation at 25 Gb/s with the fabricated optical transceiver that contains an FPC-OE, microlens-imprinted film, and a polymer waveguide.
  • Keywords
    high-speed optical techniques; microlenses; nanolithography; optical films; optical interconnections; optical polymers; optical transceivers; optical waveguides; printed circuits; soft lithography; bit rate 25 Gbit/s; flexible optical engine; high-end server systems; high-speed on-board optical interconnection; microlens-imprinted film; nanoimprint technology; optical transceiver modules; polymer waveguide; printed circuit optical engine; Lenses; Microoptics; Optical films; Optical polymers; Optical receivers; Optical waveguides;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd
  • Conference_Location
    San Diego, CA
  • ISSN
    0569-5503
  • Print_ISBN
    978-1-4673-1966-9
  • Electronic_ISBN
    0569-5503
  • Type

    conf

  • DOI
    10.1109/ECTC.2012.6249035
  • Filename
    6249035