Title :
A Wafer test method of inductive-coupling link
Author :
Kasuga, Kazutaka ; Saito, Mitsuko ; Takeya, Tsutomu ; Miura, Noriyuki ; Ishikuro, Hiroki ; Kuroda, Tadahiro
Author_Institution :
Dept. of Electron. & Electr. Eng., Keio Univ., Yokohama, Japan
Abstract :
This paper provides the method for wafer test of an inductive-coupling link. The inductive-coupling link can be tested whether it operates correctly before stacking chips. We provided the method that verify the operation of an inductive-coupling link from the relation between coupling coefficient of inductors and power that transmitter consumes.
Keywords :
electromagnetic induction; integrated circuit testing; interconnections; coupling coefficient; inductive coupling link; inductors; transmitter; wafer test method; Testing;
Conference_Titel :
Solid-State Circuits Conference, 2009. A-SSCC 2009. IEEE Asian
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-4433-5
Electronic_ISBN :
978-1-4244-4434-2
DOI :
10.1109/ASSCC.2009.5357251
