Title :
Demonstration of high-bandwidth data transmission above 240 Gbps for optoelectronic module with low-loss and low-crosstalk polynorbornene waveguides
Author :
Ito, Yuka ; Terada, Shinsuke ; Singh, Mayank Kumar ; Arai, Shinya ; Choki, Koji
Author_Institution :
Opt. Interconnection Bus. Dev. Dept., Sumitomo Bakelite Co., Ltd., Utsunomiya, Japan
fDate :
May 29 2012-June 1 2012
Abstract :
We developed a novel flexible optoelectronic (O/E) transceiver module designed for high-bandwidth and low loss data transmission for board level interconnects. In the O/E module, integrated circuits (ICs) and two 12 channel O/E devices including 850 nm vertical-cavity surface-emitting laser diodes (VCSELs) and photodiodes (PDs) were flip-chip assembled on flexible printed circuit (FPC). O/E modules and a sheet of 24-channel polynorbornene (PNB) waveguides were fabricated separately by using cost-effective and standard packaging processes. At the end of the O/E module fabrication process, the PNB waveguide sheet was integrated on completed FPCs with ICs and O/E devices using bonding sheets. Micro-mirrors formed in PNB waveguides were passively aligned toward the corresponding active areas of O/E devices respectively. The PNB waveguide sheet (120 mm long) was bi-directionally linked between O/E modules. We successfully demonstrated data transmission up to 16 Gbps/channel using an optical linked O/E transceiver module with low-loss and low-crosstalk PNB waveguides.
Keywords :
flexible electronics; flip-chip devices; integrated optoelectronics; micromirrors; optical interconnections; optical transceivers; optical waveguides; photodiodes; printed circuits; surface emitting lasers; 24-channel polynorbornene waveguides; O/E module fabrication; VCSEL; board level interconnects; bonding sheets; flexible optoelectronic transceiver module; flexible printed circuit; flip-chip assembly; high-bandwidth data transmission; low-crosstalk polynorbornene waveguides; low-loss polynorbornene waveguides; micromirrors; optical linked O/E transceiver module; packaging process; photodiodes; vertical-cavity surface-emitting laser diodes; wavelength 850 nm; Data communication; Loss measurement; Optical crosstalk; Optical device fabrication; Optical interconnections; Optical losses; Optical waveguides;
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4673-1966-9
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2012.6249038