DocumentCode
2724905
Title
A comparative numerical simulation of a nanoscaled body on Insulator FinFET
Author
Anwar, Ashfaqul ; Hossain, Imran
Author_Institution
Bangladesh Univ. of Eng. & Technol., Dhaka, Bangladesh
fYear
2010
fDate
16-19 May 2010
Firstpage
413
Lastpage
416
Abstract
In this paper a FinFET structure with channel region insulated from body by buried oxide(Body Over Insulator) is proposed. Body Over Insulator (BOI) FinFET has advantage over both Silicon Over Insulator(SOI) and Bulk FinFETs. Here, a comparative numerical study of a BOI FinFET, a bulk FinFET and a SOI FinFET is presented. The result have shown that, the proposed BOI FinFET has better short channel effect(SCE) suppression and a lower threshold voltage than bulk FinFET. Better heat dissipation capability by virtue of a smaller insulation, ease of fabrication and acceptable SCE suppression makes this structure a viable competitor of the SOI structure.
Keywords
MOSFET; silicon-on-insulator; FinFET structure; SOI FinFET; body over insulator FinFET; bulk FinFET; channel region; comparative numerical simulation; heat dissipation; nanoscaled body on insulator FinFET; short channel effect suppression; silicon over insulator; threshold voltage; CMOS technology; FETs; Fabrication; FinFETs; Impurities; Insulation; Leakage current; Numerical simulation; Silicon on insulator technology; Threshold voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Microelectronics Proceedings (MIEL), 2010 27th International Conference on
Conference_Location
Nis
Print_ISBN
978-1-4244-7200-0
Type
conf
DOI
10.1109/MIEL.2010.5490451
Filename
5490451
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