• DocumentCode
    2724905
  • Title

    A comparative numerical simulation of a nanoscaled body on Insulator FinFET

  • Author

    Anwar, Ashfaqul ; Hossain, Imran

  • Author_Institution
    Bangladesh Univ. of Eng. & Technol., Dhaka, Bangladesh
  • fYear
    2010
  • fDate
    16-19 May 2010
  • Firstpage
    413
  • Lastpage
    416
  • Abstract
    In this paper a FinFET structure with channel region insulated from body by buried oxide(Body Over Insulator) is proposed. Body Over Insulator (BOI) FinFET has advantage over both Silicon Over Insulator(SOI) and Bulk FinFETs. Here, a comparative numerical study of a BOI FinFET, a bulk FinFET and a SOI FinFET is presented. The result have shown that, the proposed BOI FinFET has better short channel effect(SCE) suppression and a lower threshold voltage than bulk FinFET. Better heat dissipation capability by virtue of a smaller insulation, ease of fabrication and acceptable SCE suppression makes this structure a viable competitor of the SOI structure.
  • Keywords
    MOSFET; silicon-on-insulator; FinFET structure; SOI FinFET; body over insulator FinFET; bulk FinFET; channel region; comparative numerical simulation; heat dissipation; nanoscaled body on insulator FinFET; short channel effect suppression; silicon over insulator; threshold voltage; CMOS technology; FETs; Fabrication; FinFETs; Impurities; Insulation; Leakage current; Numerical simulation; Silicon on insulator technology; Threshold voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronics Proceedings (MIEL), 2010 27th International Conference on
  • Conference_Location
    Nis
  • Print_ISBN
    978-1-4244-7200-0
  • Type

    conf

  • DOI
    10.1109/MIEL.2010.5490451
  • Filename
    5490451