Title :
New patternable dielectric and optical materials for MCM-L/D- and o/e-MCM-packaging
Author :
Robertsson, Mats ; Dabek, Alexander ; Gustafsson, Goran ; Hagel, Olle-Jonny ; Popall, Michael
Author_Institution :
Ericsson Components AB, Stockholm, Sweden
Abstract :
Photopatternable inorganic-organic copolymers (ormocers, or organically modified ceramics) with negative resist behaviour have been developed and tested as thin film materials for electrical and/or optical packaging purposes, e.g. MCM-L/D and optoelectronic MCM packaging. Good processability in combination with a much lower post-curing temperature (120°C-170°C) than alternative materials such as polyimide and benzocyclobutene enables the use of low cost glass fiber reinforced polymer substrates such as FR-4 and BT. The good electrical, optical and other properties are presented and discussed. The process and tentative design-rules for multilayer MCM-L/Ds are described and some test-vehicles are presented, emphasizing the versatility and low-cost potential of the new materials
Keywords :
circuit testing; dielectric thin films; inorganic polymers; integrated circuit packaging; laminates; multichip modules; optical polymers; photolithography; polymer blends; 120 to 170 C; BT substrate; FR-4 substrate; MCM-D; MCM-L; benzocyclobutene; design-rules; electrical packaging; electrical properties; glass fiber reinforced polymer substrates; materials cost; multilayer MCM-D; multilayer MCM-L; negative resist behaviour; o/e-MCM-packaging; optical packaging; optical properties; optoelectronic MCM packaging; organically modified ceramics; ormocers; patternable dielectric materials; patternable optical materials; photopatternable inorganic-organic copolymers; polyimide; post-curing temperature; processability; test-vehicles; thin film materials; Ceramics; Dielectric materials; Dielectric thin films; Materials testing; Optical films; Optical materials; Optical polymers; Packaging; Polymer films; Resists;
Conference_Titel :
Polymeric Electronics Packaging, 1997. Proceedings., The First IEEE International Symposium on
Conference_Location :
Norrkoping
Print_ISBN :
0-7803-3865-0
DOI :
10.1109/PEP.1997.656491