Title :
Package-on-package for chip cooling with embedded fluidics
Author :
Chua, Tiffany ; Babikian, Sarkis ; Wu, Liang ; Li, G.-P. ; Bachman, Mark
Author_Institution :
Univ. of California, Irvine, CA, USA
fDate :
May 29 2012-June 1 2012
Abstract :
Modern semiconductor chips are reaching higher power densities, requiring cooling capacities in excess of 100 W/cm2. Liquid cooling is widely seen as the appropriate technology to provide cooling for these devices, however, convenient, integrated cooling techniques are not available. We report the use of a chip cooling package designed to interface directly with an embedded fluidic system that routes cooling liquid on a printed circuit board. The package is designed as a “package-on-package” construction so that it can be packaged over an existing electronic chip to provide fluid-based cooling to a variety of components. This paper presents package design and construction, fluidic integration, and flow/thermal performance of this package.
Keywords :
cooling; fluidics; integrated circuit packaging; chip cooling package; electronic chip; embedded fluidic system; embedded fluidics; flow thermal performance; fluid based cooling; fluidic integration; liquid cooling; package design; package-on-package; printed circuit board; semiconductor chips; Coolants; Fluids; Heat transfer; Heating; Temperature measurement; Temperature sensors;
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4673-1966-9
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2012.6249051