Title :
Decoupling optimization for IC-package and PCB systems considering high performance microprocessor core and signal interface interactions
Author_Institution :
Sigrity, Inc., Campbell, CA, USA
fDate :
May 29 2012-June 1 2012
Abstract :
The purpose of this paper is to present a modeling and simulation based efficient DECAP optimization process for high performance microprocessor systems consisting of IC-package and PCB, considering the interactions due to mutual coupling of power delivery networks (PDNs) for core and signal interface, corresponding to multiple power boundaries. Effectiveness of the on-die capacitances and package mounted DECAPS on IC-package and PCB for optimizing the input impedance of multiple PDNs is described and illustrated with several simulation results.
Keywords :
capacitors; circuit optimisation; integrated circuit modelling; integrated circuit packaging; microprocessor chips; printed circuits; IC-package; PCB systems; PDN mutual coupling; decoupling capacitors; decoupling optimization; high performance microprocessor core; multiple power boundary; on-die capacitances; power delivery networks; signal interface interactions; simulation based efficient DECAP optimization process; Analytical models; Capacitance; Impedance; Integrated circuit modeling; Microprocessors; Optimization; Printed circuits;
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4673-1966-9
Electronic_ISBN :
0569-5503
DOI :
10.1109/ECTC.2012.6249082
