Refined but handy electrical models of TSV usable from low to high density and for RF or fast digital signals in 3D-IC

Author

Fourneaud, L. ; Lacrevaz, T. ; Bermond, C. ; Charbonnier, J. ; Fuchs, C. ; Farcy, A. ; Gaeremynck, Y. ; Flechet, B.

Author_Institution

IMEP LAHC, Univ. de Savoie, Le Bourget du Lac, France

fYear

2012

fDate

May 29 2012-June 1 2012

Firstpage

1858

Lastpage

1865

Abstract

In this paper, new analytic models of TSV are proposed in a wide band of frequencies (DC-40GHz). These models are defined with a RLCG transmission line model in two specific configurations, a two TSV line and a often called "H-type" line of three TSV. Each RLCG parameters are compared to those extracted from electromagnetic modeling in a wide band of frequencies. Finally, a last comparison is made between analytical RLCG parameters and those extracted from measurements in a typical "H-type" case of medium density TSV with a specific methodology.

Keywords

three-dimensional integrated circuits; 3D-IC; H-type line; RF; RLCG transmission line model; TSV line; electromagnetic modeling; fast digital signals; handy electrical models; high density; medium density TSV; two specific configurations; Conductors; Equations; Inductance; Magnetic fields; Mathematical model; Substrates; Through-silicon vias;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd

Conference_Location

San Diego, CA

ISSN

0569-5503

Print_ISBN

978-1-4673-1966-9

Electronic_ISBN

0569-5503

Type

conf

DOI

10.1109/ECTC.2012.6249091

Filename

6249091