DocumentCode :
2726317
Title :
A new approach towards an optimum design and manufacture of microfluidic devices based on ex situ fabricated hydrogel based thin films´ integration
Author :
Zhao, Weiwei ; Santaniello, Tommaso ; Webb, Patrick ; Lenardi, Cristina ; Liu, Changqing
Author_Institution :
Wolfson Sch. of Mech. & Manuf. Eng., Loughborough Univ., Loughborough, UK
fYear :
2012
fDate :
May 29 2012-June 1 2012
Firstpage :
1997
Lastpage :
2004
Abstract :
We present a compression based packaging technique which can be applied to reversibly seal hydrogel based materials´ thin films and micro-fabricated thermoplastic components for hybrid materials stacking microfluidic cells-based chips design. A multilayer microdevice has been realized for liquid leakage tests at the thermoplastic/hydrogel interface nearby the fluidic circuits machined on the plastic layer; biocompatible Poly-hydroxyethylmethacrylate (PHEMA) hydrogel membranes with different thickness (Ranging from 100 to 200 μm) and micro-milled Polymethylmethacrylate components were chosen to realize the chip. By promoting continuous perfusion of the system pumping aqueous coloured dye solutions in the microchannels, the sealing between the two materials resulted guaranteed for tested flow rate values, ranging from 100nL/min to 10mL/min. Furthermore, to take the hydrogel into operation, a representative case study of a micro-bioreactor based on joint hybrid materials and employing PHEMA thin film as a cell culture substrate has been analyzed and modelled by mean of numerical simulation.
Keywords :
hydrogels; microfluidics; numerical analysis; semiconductor device packaging; PHEMA thin film; aqueous coloured dye solutions; biocompatible poly-hydroxyethylmethacrylate hydrogel membranes; cell culture substrate; compression based packaging technique; ex situ fabricated hydrogel; fluidic circuits; hydrogel based materials; joint hybrid materials; liquid leakage tests; microbioreactor; microchannels; microfabricated thermoplastic components; microfluidic cells-based chips design; microfluidic devices; micromilled polymethylmethacrylate components; multilayer microdevice; numerical simulation; plastic layer; size 100 mum to 200 mum; thermoplastic/hydrogel interface; thin films integration; Bonding; Films; Liquids; Microfluidics; Packaging;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd
Conference_Location :
San Diego, CA
ISSN :
0569-5503
Print_ISBN :
978-1-4673-1966-9
Electronic_ISBN :
0569-5503
Type :
conf
DOI :
10.1109/ECTC.2012.6249114
Filename :
6249114
Link To Document :
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