Title :
Nanostructured epoxy/POSS composites: enhanced materials for high voltage insulation applications
Author :
Heid, Thomas ; FreÌchette, Michel ; David, Eric
Author_Institution :
Ecole de Technol. Super., Montreal, QC, Canada
Abstract :
In this study, the dielectric and thermal properties of nanostructured epoxy/POSS (Polyhedral Oligomeric Silsesquioxanes) composites were investigated, using a reactive Triglycidylisobutyl-POSS (TGIB-POSS) additive from 1 up to 10 wt%. POSS has been successfully dispersed at a molecular level for low content composites, which show a remarkably improved resistance to corona discharges, with up to 60% less eroded sample volume, along with significantly increased dielectric breakdown strengths and thermal conductivities. Epoxy/POSS composites containing 5 wt% and more of the POSS additive exhibit agglomerations, which have been observed by SEM. Furthermore, dielectric spectroscopy revealed additional interfacial loss peaks for such composites containing 5 wt% POSS and more, in addition to the α- and β-peaks known for epoxy.
Keywords :
additives; dielectric properties; electric breakdown; epoxy insulation; nanostructured materials; scanning electron microscopy; thermal conductivity; thermal properties; POSS composite; SEM; agglomeration; corona discharge; dielectric breakdown strength; dielectric property; dielectric spectroscopy; high voltage insulation application; interfacial loss; molecular level; nanostructured epoxy; polyhedral oligomeric silsesquioxane; reactive TGIB-POSS; scanning electron microscopy; thermal conductivity; thermal property; triglycidylisobutyl-POSS additive; Conductivity; Dielectrics; Electric breakdown; Electrodes; Insulation; Polymers; Temperature measurement; AC breakdown strength; POSS; dielectric spectroscopy; electrical discharge; epoxy; interface; polymer composites; surface erosion; thermal conductivity;
Journal_Title :
Dielectrics and Electrical Insulation, IEEE Transactions on
DOI :
10.1109/TDEI.2015.7116355
