Active cooling analysis of the micro pump used in IGBT power module

The problem of heat dissipation of high power electronics such as IGBT (Insulated Gate Bipolar Transistors) has puzzled us for long time. If the heat generated from the chips could not be eliminated away from the devices, the failure rate would rise rapidly. To deal with this problem, the micro pumps along with the microchannel embedded in the DBC substrate are proposed to remove the heat actively with high efficiency. In this paper, a 1200V 75A IGBT module was chosen to be investigated. The configuration, basic property and function of micro pump was briefly described. Then, the internal structure and detailed component were investigated by the method of dissection. Moreover, a finite element model was built to analyze the thermal performance of the new IGBT module integrated with two different kinds of microchannels and the thermal perfermance of this new IGBT module is studied by CFD (computational fluid dynamics). As shown in the results, the temperature decreased to less than 100°C. Besides, the temperature uniformity is around 1°C, a significant advantage for long term reliability.