DocumentCode
2726753
Title
Robust, novel, and low cost superhydrophobic nanocomposites coating for reliability improvement of microelectronics
Author
Liu, Yan ; Lin, Ziyin ; Moon, Kyoung-sik ; Wong, C.P.
Author_Institution
Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA, USA
fYear
2012
fDate
May 29 2012-June 1 2012
Firstpage
2135
Lastpage
2139
Abstract
The reliability is an important issue for IC devices. Since moisture, mobile ions, ultraviolet, and other hostile environment will affect the device performance and lifetime. In our study, a robust conformal superhydrophobic (SH) coating will be applied to improve the reliability of the device. SH epoxy/nano silica composites were spin-coated on triple track resistors (TTR). An O2 plasma treatment was used to generate surface roughness on the cured epoxy. SH surfaces were produced after functionalization with perfluorooctyl trichlorosilane of low surface energy. The effect of plasma etching time on superhydrophobicty was investigated. A water contact angle of 170° and contact angle hysteresis of 2° were achieved when the etching time increased to 15 min. The leakage currents under bias for SH coated TTR were measured with aging time. The reliability test showed stable leakage current for 1000 hours, and the self-cleaning performance of the SH surface successfully protects the device.
Keywords
hydrophobicity; integrated circuit reliability; leakage currents; nanocomposites; plasma materials processing; resins; silicon compounds; spin coating; sputter etching; surface cleaning; SiO2; cured epoxy; leakage current; microelectronic reliability; plasma etching; plasma treatment; robust conformal superhydrophobic coating; self-cleaning performance; spin coating; superhydrophobic epoxy/nano silica composites; superhydrophobic nanocomposites coating; surface roughness; time 1000 hr; triple track resistors; Coatings; Etching; Rough surfaces; Silicon compounds; Surface morphology; Surface roughness;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd
Conference_Location
San Diego, CA
ISSN
0569-5503
Print_ISBN
978-1-4673-1966-9
Electronic_ISBN
0569-5503
Type
conf
DOI
10.1109/ECTC.2012.6249137
Filename
6249137
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