• DocumentCode
    2727379
  • Title

    A virtual simulation package for Embedded System training and education

  • Author

    Cho, Sang-Young

  • Author_Institution
    Comput. Sci. & Eng. Dept., Hankuk Univ. of Foreign Studies, Yongin, South Korea
  • fYear
    2009
  • fDate
    7-8 Dec. 2009
  • Firstpage
    72
  • Lastpage
    76
  • Abstract
    Laboratory assignments for Embedded System courses are usually performed with a hardware-based training kit that equipped with an embedded system board, software development tools, and optionally an emulator for debugging. Using the hardware-based kits has some demerits such as high initial setup cost, burdensome maintenance, lacks of adaptability to industry evolution, and restricted educational outcomes. This paper deals with a simulation-based education package for laboratory works in Embedded System courses. The package uses the ARM´s ARMulator environment that can simulate a simple ARM architecture board in cycle-level. We extended the ARMulator environment into a powerful one that can simulate an embedded system board by implementing various hardware IP models and peripheral simulation programs. The developed education package can be used to train students in Embedded System courses for topics such as assembly and C/C++ programming, processor architecture, memory system handling, peripheral control, system performance, real-time operating system, and development environment with overcoming the demerits of hardware-based kits.
  • Keywords
    Costs; Debugging; Educational programs; Embedded system; Hardware; Industrial training; Laboratories; Packaging; Power system modeling; Programming; ARMulator; education; embedded systemt; modeling; simulation; training kit; virtual environment;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering Education (ICEED), 2009 International Conference on
  • Conference_Location
    Kuala Lumpur, Malaysia
  • Print_ISBN
    978-1-4244-4843-2
  • Electronic_ISBN
    978-1-4244-4844-9
  • Type

    conf

  • DOI
    10.1109/ICEED.2009.5490609
  • Filename
    5490609